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Dell M5030 Motherboard GPU Copper Shim Thermal Pad - Prevent 7 Beep Overheat

$ 5.78

Availability: 223 in stock
  • Non-Domestic Product: No
  • MPN: Does Not Apply
  • Modified Item: No
  • Material: Copper
  • Brand: Dell
  • Type: Thermal Pad
  • Item must be returned within: 30 Days
  • Return shipping will be paid by: Buyer
  • Refund will be given as: Money Back
  • Condition: Replace the thick thermal pad on your m5030 with this copper shim kit to greatly lower gpu temps
  • Restocking Fee: No
  • Custom Bundle: No
  • All returns accepted: Returns Accepted

    Description

    Dell Inspiron M5030 GPU Copper Shim Kit For Heatsink
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    Thermal paste is not included and is required to install the shim kit.  You will need to have your own thermal paste.
    O
    ver 5000 shim kits sold!
    Be the next to keep your laptop safe from future overheating failure!
    Replace the thick thermal pad in your laptop with copper shims to greatly lower gpu temps
    For models with ati/amd graphics chip only
    Lower your gpu temps 15% and keep gpu failure from happening
    --Included--
    Copper shim kit with for an exact fit of the so
    uthbridge
    gpu gap
    High quality
    fujipo
    ly 6w/mk
    thermal pad for northbridge gpu
    High quality fujip
    oly
    thermal putty
    Materials to lap/polish your gpu and heatsink for best thermal conductivity
    Detailed instructions
    _______________________________________________________________________________________
    If you would prefer using high quality thermal pads instead of copper shims
    I have another auction
    CLICK HERE
    __________________________________________________________________________________________________
    There are two install options included.  Copper shim kit only or copper shim/high quality thermal putty(recommended) pictured below.
    This high quality thermal putty forms to/surrounds the gpu die when heat from the motherboard and pressure from the heatsink is applied leaving a tight seal for the best possible thermal conductivity.